ʻO ka Pepa Copper Profile Haʻahaʻa (LP -SP/B)

Mānoanoa: 12um 15um 18um 35um 70um 105um

Ka laulā maʻamau: 1290mm, hiki ke ʻoki ʻia e like me ka noi nui

Puke pahu lāʻau


Huahana Huahana

Huahana Huahana

kikoʻī

Mānoanoa: 12um 18um 25um 35um 50um 70um 105um
Ka laulā maʻamau: 1290mm, hiki ke ʻoki ʻia e like me ka noi nui
Puke pahu lāʻau
ID:76 mm, 152 mm
Length: Hoʻopilikino
Hiki ke hāʻawi ʻia ka laʻana

Nā hiʻohiʻona

Hoʻohana nui ʻia kēia foil no nā PCB multilayered a me nā papa kaapuni kiʻekiʻe kiʻekiʻe, ka mea e koi ai i ka roughness ili o ka foil e haʻahaʻa ma mua o ka pahu keleawe maʻamau i hiki ai i kā lākou mau hana e like me ka peeling resistance ke noho ma kahi kiʻekiʻe.Aia ia i kahi ʻāpana kūikawā o ka foil keleawe electrolytic me ka hoʻomalu ʻino.Ke hoʻohālikelike ʻia me ka pahu keleawe electrolytic maʻamau, ʻo nā kristal o LP copper foil he mau huaʻai equiaxed maikaʻi loa (<2/zm).Loaʻa iā lākou nā kristal lamellar ma kahi o nā kolamu, ʻoiai ke hōʻike nei lākou i nā kuapo palahalaha a me kahi haʻahaʻa haʻahaʻa o ka ʻili.Loaʻa iā lākou nā pono e like me ka ʻoi aku ka maikaʻi o ka nui a me ka ʻoi aku ka paʻakikī.

Haʻahaʻa haʻahaʻa no FCCL
MIT kiʻekiʻe
Etchability maikaʻi loa
ʻO ka pepa i mālama ʻia he ʻulaʻula a ʻeleʻele paha

Palapala noi

3 ʻāpana FCCL
EMI

ʻO nā waiwai maʻamau o ke Kopa Copper Foil (LP -SP/B)

Hoʻokaʻawale

Unite

Koi

ʻAno hoʻāʻo

Mānoanoa inoa

Um

12

18

25

35

50

70

105

IPC-4562A

Kaumaha ʻāpana

g/m²

107±5

153±7

225±8

285± 10

435±15

585± 20

870±30

IPC-TM-650 2.2.12.2

Maemae

%

≥99.8

IPC-TM-650 2.3.15

ʻoʻoleʻa

ʻaoʻao ʻālohilohi (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

ʻaoʻao maʻemaʻe(Rz)

um

≤4.5

≤5.0

≤6.0

≤7.0

≤8.0

≤12

≤14

Ikaika U'i

RT(23°C)

Mpa

≥207

≥276

IPC-TM-650 2.4.18

HT(180°C)

≥138

ʻO ka lōʻihi

RT(23°C)

%

≥4

≥4

≥5

≥8

≥10

≥12

≥12

IPC-TM-650 2.4.18

HT(180°C

≥4

≥4

≥5

≥6

≥8

≥8

≥8

Resistivity

Ω.g/m²

≤0.17 0

≤0.1 66

 

≤0.16 2

 

≤0.16 2

≤0.16 2

IPC-TM-650 2.5.14

Ka Ihi (FR-4)

N/mm

≥1.0

≥1.3

 

≥1.6

 

≥1.6

≥2.1

IPC-TM-650 2.4.8

Pinho & Porosity Helu

 

 

No

IPC-TM-650 2.1.2

Anati-oxidization RT(23°C) Dʻae

 

 

180

 
HT(200°C) Nā minuke

 

 

30

 

Laulā maʻamau,1295(±1)mm, Laulā laula:200-1340mm.Mei e like me ka mea kūʻai mai noi humuhumu.

5G Papa alapine kiʻekiʻe Ultra Low Profile Copper Foil1

  • Mua:
  • Aʻe:

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