Paʻi keleawe ʻano haʻahaʻa haʻahaʻa loa (VLP-SP/B)

Hoʻonui nui ka hoʻomaʻamaʻa ʻana i ka micro-roughening sub-micron i ka ʻili o ka ʻili me ka ʻole o ka hoʻopili ʻana i ka palaka, he mea kōkua nui ia no ka hoʻonui ʻana i ka ikaika adhesion.


Huahana Huahana

Huahana Huahana

Hoʻonui nui ka hoʻomaʻamaʻa ʻana i ka micro-roughening sub-micron i ka ʻili o ka ʻili me ka ʻole o ka hoʻopili ʻana i ka palaka, he mea kōkua nui ia no ka hoʻonui ʻana i ka ikaika adhesion.Me ka hoʻopili ʻana i nā ʻāpana kiʻekiʻe, ʻaʻohe hopohopo no ka hāʻule ʻana o nā ʻāpana a me nā laina hoʻohaumia.Mālama ʻia ka waiwai Rzjis ma hope o ka hoʻopaʻapaʻa ʻana ma 1.0 µm a maikaʻi nō hoʻi ka ʻike o ke kiʻiʻoniʻoni ma hope o ke kālai ʻia ʻana.

kikoʻī

Mānoanoa: 12um 18um 35um 50um 70um
Ka laulā maʻamau: 1290mm, Ka laulā ākea: 200-1340mm, hiki ke ʻoki ʻia e like me ka noi nui.
Puke pahu lāʻau
ID:76 mm, 152 mm
Length: Hoʻopilikino
Hiki ke hāʻawi ʻia ka laʻana

Nā hiʻohiʻona

ʻO ka pepa i mālama ʻia he ʻulaʻula a ʻeleʻele electrolytic copper foil o ka haʻahaʻa haʻahaʻa o ka ʻili.Ke hoʻohālikelike ʻia me ka foil keleawe electrolytic maʻamau, ʻoi aku ka maikaʻi o kēia pepa VLP, nā mea i hoʻohālikelike ʻia me nā kuamoʻo pālahalaha, he 0.55μm ka ʻili o ka ʻili, a loaʻa iā ia nā pono e like me ka nui o ka paʻa a me ka paʻakikī kiʻekiʻe.Hoʻohana ʻia kēia huahana i nā mea kiʻekiʻe a me ka wikiwiki nui, ka nui o nā papa kaapuni maʻalahi, nā papa kaapuni kiʻekiʻe, a me nā papa kaapuni ultra-fine.
Haʻahaʻa loa
MIT kiʻekiʻe
Etchability maikaʻi loa

Palapala noi

2 papa 3 ʻāpana FPC
EMI
Kaapuni maikai
Ke kelepona paʻa lima kelepona
Papa alapine kiʻekiʻe

ʻO nā waiwai maʻamau o ka ʻili keleawe haʻahaʻa loa

Hoʻokaʻawale

Unite

Koi

ʻAno hoʻāʻo

Mānoanoa inoa

Um

12

18

35

50

70

IPC-4562A

Kaumaha ʻāpana

g/m²

107±5

153±7

285± 10

435±15

585± 20

IPC-TM-650 2.2.12.2

Maemae

%

≥99.8

IPC-TM-650 2.3.15

ʻoʻoleʻa

ʻaoʻao ʻālohilohi (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

ʻaoʻao maʻemaʻe(Rz)

um

≤3.0

≤3.0

≤3.0

≤3.0

≤3.0

Ikaika U'i

RT(23°C)

Mpa

≥300

IPC-TM-650 2.4.18

HT(180°C)

≥180

ʻO ka lōʻihi

RT(23°C)

%

≥5

≥6

≥8

≥10

≥10

IPC-TM-650 2.4.18

HT(180°C

≥6

≥6

≥6

≥6

≥6

Ka Ihi (FR-4)

N/mm

≥0.8

≥0.8

≥1.0

≥1.2

≥1.4

IPC-TM-650 2.4.8

lbs/in

≥4.6

≥4.6

≥5.7

≥6.8

≥8.0

Pinho & Porosity Heluhelu

No

IPC-TM-650 2.1.2

Anati-oxidization RT(23°C) Dʻae

180

 
HT(200°C)

Nā minuke

30

/

5G Papa alapine kiʻekiʻe Ultra Low Profile Copper Foil1

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