ʻaoʻao ʻelua ʻaoʻao keleawe i mālama ʻia no HDI
●Mānoanoa: 12um 18um 35um 70um
●Ka laulā maʻamau: 1290mm, Hiki iā mākou ke ʻoki e like me ke koi nui
●ID: 76 mm, 152 mm
●Length: Hoʻopilikino
●Hiki ke hāʻawi ʻia ka laʻana;Ka manawa alakaʻi: 7 mau lā
●Ka manawa hoʻouna: 15-20days
●Nā kikoʻī kikoʻī: Export Wooden box
●Manaʻo: FOB, CIF.
●Uku 'ikamu: 50% T / T waiho, uku kaulike ma mua o ka hoʻouna.
●ʻO nā mea hana kiʻekiʻe o ka hoʻokuʻu ʻana e hana i ka hana hana ʻana o ka foil keleawe.
●ʻaoʻao lua i mālama ʻia Copper foil
●Me ka ikaika paʻa kiʻekiʻe e laminate
●Lamination multi-layer pololei
●ʻO ka etchability maikaʻi
●ʻO ka pepa i mālama ʻia he ʻulaʻula
●Papa Kaapuni Pai Nui
●HDI (High Density Interconnector) no PCB
| Hoʻokaʻawale | Unite | Koi | ʻAno hoʻāʻo | ||||||
| Hoʻokohu Foil |
| T | H | 1 | 2 | IPC-4562A | |||
| Mānoanoa inoa | um | 12 | 18 | 35 | 70 | IPC-4562A | |||
| Kaumaha ʻāpana | g/m² | 107±5 | 153±7 | 285± 10 | 585± 20 | IPC-TM-650 2.2.12 | |||
| Maemae | % | ≥99.8 | IPC-TM-650 2.3.15 | ||||||
| Roughness | ʻaoʻao ʻālohilohi (Ra) | um | ≤3.0 | IPC-TM-650 2.2.17 | |||||
| ʻaoʻao maʻemaʻe(Rz) | um | ≤6 | ≤8 | ≤10 | ≤15 | ||||
| Ikaika U'i | RT(23°C) | Mpa | ≥207 | ≥207 | ≥276 | ≥276 | IPC-TM-650 2.4.18 | ||
| H.T.(180°C) | ≥103 | ≥103 | ≥138 | ≥138 | |||||
| ʻO ka lōʻihi | RT(23°C) | % | ≥2 | ≥2 | ≥3 | ≥3 | IPC-TM-650 2.4.18 | ||
| H.T.(180°C) | ≥2 | ≥2 | ≥2 | ≥3 | |||||
| Kū'ē | Ωg/m² | ≤0.170 | ≤0.166 | ≤0.162 | ≤0.162 | IPC-TM-650 2.5.14 | |||
| Ka Ihi (FR-4) | ʻaoʻao S | N/mm | ≥0.9 | ≥0.9 | ≥1.4 | ≥1.4 | IPC-TM-650 2.4.8 | ||
| Lbs/in | ≥5.1 | ≥6.3 | ≥8.0 | ≥8.0 | |||||
| M aoao | N/mm | ≥0.9 | ≥1.1 | ≥1.4 | ≥2.0 | ||||
| Lbs/in | ≥5.1 | ≥6.3 | ≥8.0 | ≥11.4 | |||||
| Pinholes & porosity | Helus | No | IPC-TM-650 2.1.2 | ||||||
| Anati-oxidization | RT(23°C) | Nā lā | 180 | / | |||||
| H.T.(200°C) | Nā minuke | 40 | / | ||||||
Laulā maʻamau,1295(±1)mm, Laulā laula:200-1340mm.Mei e like me ka mea kūʻai mai noi humuhumu.
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