Hyper Loa Haʻahaʻa Profile Copper Foil No Kiʻi kikohoʻe kiʻekiʻe
●Hōʻike haʻahaʻa haʻahaʻa me ka ikaika peel kiʻekiʻe a me ka mana etch maikaʻi
●E hoʻohana i ka ʻenehana haʻahaʻa haʻahaʻa haʻahaʻa, hana ka microstructure i mea maikaʻi loa e hoʻopili ai i ke kaapuni hoʻouna alapine kiʻekiʻe
●ʻO ka pepa i mālama ʻia he ʻulaʻula
●Kaapuni lawe alapine kiʻekiʻe
●kahua kahua/kauwau
●Kikohoʻe wikiwiki kiʻekiʻe
●PPO/PPE
Hoʻokaʻawale | Unite | ʻAno hoʻāʻo | TʻO ke ʻano hana | |||
Mānoanoa inoa | Um | 12 | 18 | 35 | IPC-4562A | |
Kaumaha ʻāpana | g/m² | 107±5 | 153±7 | 285±10 | IPC-TM-650 2.2.12.2 | |
Maemae | % | ≥99.8 | IPC-TM-650 2.3.15 | |||
ʻoʻoleʻa | ʻaoʻao ʻālohilohi (Ra) | սm | ≤0.43 | ≤0.43 | ≤0.43 | IPC-TM-650 2.3.17 |
ʻaoʻao maʻemaʻe(Rz) | um | 1.5-2.0 | 1.5-2.0 | 1.5-2.0 |
| |
Ikaika U'i | RT(23°C) | Mpa | ≥300 | ≥300 | ≥300 | IPC-TM-650 2.4.18 |
HT(180°C) | ≥180 | ≥180 | ≥180 |
| ||
ʻO ka lōʻihi | RT(23°C) | % | ≥5 | ≥6 | ≥8 | IPC-TM-650 2.4.18 |
HT(180°C) | ≥6 | ≥6 | ≥6 |
| ||
Pinho & Porosity | Helu | No | IPC-TM-650 2.1.2 | |||
PKa ikaika iʻa | N/mm | ≥0.6 | ≥0.8 | ≥1.0 | IPC-TM-650 2.4.8 | |
Lbs/in | ≥3.4 | ≥4.6 | ≥5.7 | |||
Anati-oxidization | RT(23°C) | Nā lā | 90 |
| ||
RT(200°C) | Nā minuke | 40 |