Hyper Loa Haʻahaʻa Profile Copper Foil No Kiʻi kikohoʻe kiʻekiʻe

Mānoanoa: 12um 18um 35um

Laulā maʻamau: 1290mm, Max.laula 1340mm;hiki ke oki e like me ka nui noi

Puke pahu lāʻau


Huahana Huahana

Huahana Huahana

Nā hiʻohiʻona

Hōʻike haʻahaʻa haʻahaʻa me ka ikaika peel kiʻekiʻe a me ka mana etch maikaʻi
E hoʻohana i ka ʻenehana haʻahaʻa haʻahaʻa haʻahaʻa, hana ka microstructure i mea maikaʻi loa e hoʻopili ai i ke kaapuni hoʻouna alapine kiʻekiʻe
ʻO ka pepa i mālama ʻia he ʻulaʻula

Hoʻohana maʻamau

Kaapuni lawe alapine kiʻekiʻe
kahua kahua/kauwau
Kikohoʻe wikiwiki kiʻekiʻe
PPO/PPE

Nā ʻano maʻamau o Hyper Haʻahaʻa haʻahaʻa loa Copper Foil

Hoʻokaʻawale

Unite

ʻAno hoʻāʻo

TʻO ke ʻano hana

Mānoanoa inoa

Um

12

18

35

IPC-4562A

Kaumaha ʻāpana

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Maemae

%

≥99.8

IPC-TM-650 2.3.15

ʻoʻoleʻa

ʻaoʻao ʻālohilohi (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

ʻaoʻao maʻemaʻe(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

 

Ikaika U'i

RT(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

HT(180°C)

≥180

≥180

≥180

 

ʻO ka lōʻihi

RT(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

HT(180°C)

≥6

≥6

≥6

 

Pinho & Porosity

Helu

No

IPC-TM-650 2.1.2

PKa ikaika iʻa

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650 2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anati-oxidization

RT(23°C)

Nā lā

90

 

RT(200°C)

Nā minuke

40

 
5G Papa alapine kiʻekiʻe Ultra Low Profile Copper Foil1

  • Mua:
  • Aʻe:

  • E kākau i kāu leka ma aneʻi a hoʻouna mai iā mākou