Hyper Haʻahaʻa Haʻahaʻa Loaʻa Copper Foil No ka Hoʻouna Kiʻekiʻe

Ke Kaʻina Hana Slitting: E ​​hana i ka slitting, ka hoʻokaʻawale ʻana, ka nānā ʻana a me ka pūʻolo e like me ke koi no ka maikaʻi, ākea a me ke kaumaha o nā pahu keleawe o nā mea kūʻai aku.


Huahana Huahana

Huahana Huahana

ʻO JIMA Copper proprietary ultra low roughness treatment process e hōʻoiaʻiʻo i ka ikaika adhesion pono no nā mea kiʻiʻoniʻoni Dk haʻahaʻa, no ka mea paʻakikī ke hoʻokō ʻana i ka ikaika adhesion, me ka ʻole o ka mōhai ʻana i nā waiwai hoʻoili.Ma muli o ka recrystallized base foil, hāʻawi pū ia i nā hiʻohiʻona kūlou maikaʻi no ka hāʻawi ʻana i ka hanauna e hiki mai ana o nā kaapuni paʻi maʻalahi.

kikoʻī

Mānoanoa: 12um 18um 35um
Ka laulā maʻamau: 1290mm, hiki ke ʻoki ʻia e like me ka noi nui.
Puke pahu lāʻau
ID: 76 mm, 152 mm
Length: Hoʻopilikino
Hiki ke hāʻawi ʻia ka laʻana
Ke alakaʻi manawa: 15-20days
ʻOkiʻoki ʻia nā mea ʻoki ʻoki kiʻekiʻe i nā foil keleawe e like me ka laulā e koi ʻia e nā mea kūʻai.
Ke Kaʻina Hana Slitting: E ​​hana i ka slitting, ka hoʻokaʻawale ʻana, ka nānā ʻana a me ka pūʻolo e like me ke koi no ka maikaʻi, ākea a me ke kaumaha o nā pahu keleawe o nā mea kūʻai aku.

Nā hiʻohiʻona

Ultra-low profile, me ka peel kiʻekiʻe
Ka ikaika a me ka etchability maikaʻi
ʻenehana coarsening haʻahaʻa

Palapala noi

Kikohoʻe wikiwiki kiʻekiʻe
kahua kahua/kauwela
PPO/PPE
E hoʻohana i ka ʻenehana haʻahaʻa haʻahaʻa haʻahaʻa, hana ka microstructure i mea maikaʻi loa e hoʻopili ai i ke kaapuni hoʻouna kiʻekiʻe.
Kaapuni alapine kiʻekiʻe / High Speed ​​Transmission.

ʻO nā ʻano maʻamau o ka Hyper Haʻahaʻa Haʻahaʻa loa Copper Foil

Hoʻokaʻawale

Unite

Koi

ʻAno hoʻāʻo

Hoʻokohu Foil

 

T

H

1

IPC-4562A

Mānoanoa inoa

um

12

18

35

IPC-4562A

Kaumaha ʻāpana

g/m²

107±5

153±7

285± 10

IPC-TM-650 2.2.12

Maemae

%

≥99.8

IPC-TM-650 2.3.15

Roughness

ʻaoʻao ʻālohilohi (Ra)

um

≤0.43

IPC-TM-650 2.2.17

ʻaoʻao maʻemaʻe(Rz)

um

1.5-2.0

ʻano ʻōpika

Ikaika U'i

RT(23°C)

Mpa

300

IPC-TM-650 2.4.18

H.T.(180°C)

180

ʻO ka lōʻihi

RT(23°C)

%

5

6

8

IPC-TM-650 2.4.18

H.T.(180°C)

6

6

6

Ka Ihi (FR-4)

N/mm

0.6

0.8

≥1.0

IPC-TM-650 2.4.8

Lbs/in

3.4

4.6

5.7

Pinholes & porosity

Helus

No

IPC-TM-650 2.1.2

Anati-oxidization

RT(23°C)

Nā lā

90

 

H.T.(200°C)

Nā minuke

40

 

Laulā maʻamau,1295(±1)mm, Laulā laula: 200-1340mm.Mei e like me ka mea kūʻai mai noi humuhumu.

5G Papa alapine kiʻekiʻe Ultra Low Profile Copper Foil1

  • Mua:
  • Aʻe:

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