Lower low colcper copper folil (vlp-sp / b)
ʻO ka hoʻomaʻamaʻaʻana o Sub-Micrron micro Me ka pākaukau kiʻekiʻe,ʻaʻohe hopohopo o nā mea e hāʻule ana a hāʻule i nā laina. ʻO ka waiwai RZJIS ma hope o ka mālamaʻiaʻana o ka roughening ma 1.0 μm a me ke kūleʻa o ke kiʻiʻoniʻoni ma hope o ke kiʻiʻana.
●ʻO ka mānoanoa: 12um 18um 35um 50m0um
●ʻO ka laulā maʻamau: 1290mm, ka laulā ākea: 200-130mm, hiki ke hōʻokiʻia e like me ke noi nui.
●ʻO ka pahu pahu pahu lāʻau
●ID: 76 MM, 152 mm
●Lōʻihi: ua hanaʻia
●Hiki ke hāʻawi
ʻO ka Foil Foil i mālamaʻia a iʻoleʻulaʻula a iʻole kalepa keleawe electrolytic i ka palupalu haʻahaʻa haʻahaʻa haʻahaʻa. Hoʻohālikelikeʻia me nā Copper Eleplotic maʻamau,ʻo kēia ka Volp Foil ka mea nui o ka crystal Ua kūpono kēia huahana i nā papa kiʻekiʻe a me ka wikiwiki o ka wikiwiki, nā papa kiʻekiʻe kiʻekiʻe, a me nā papa ipukuka kiʻekiʻe.
●Loko loa
●Ala kit
●ʻO katchability maikaʻi loa
●Luke Hou 2layer FPC
●Emi
●ʻO ke kumu kūʻai circiit
●Kelepona kelepona keleponaʻole
●Papa kiʻekiʻe kiʻekiʻe
| Ka Heluhelu | Kōho | Koi | Kūlana hōʻike | |||||
| ʻO ka mānoanoa | Um | 12 | 18 | 35 | 50 | 70 | IPC-4562A | |
| ʻO ke kaupaonaʻana | g / m ² | 107 ± 5 | 153 ± 7 | 285 ± 10 | 435 ± 15 | 585 ± 20 | IPC-TM-650 2.2.12.2 | |
| ʻO Menu ka hoʻomaʻemaʻe | % | ≥99.8 | IPC-TM-650 2.3.15 | |||||
| huahua | Lohi | ս m | Ç0.43 | IPC-TM-650 2.3.17 | ||||
| Matteʻaoʻao (rz) | um | ≤3.0 | ≤3.0 | ≤.0 | ≤3.0 | ≤3.0 | ||
| Ikaika ikaika | RT (23 ° C) | Mpa | ≥300 | IPC-TM-650 2.4.18 | ||||
| HTR (180 ° C) | ≥180 | |||||||
| Ewangantion | RT (23 ° C) | % | ≥5 | ≥6 | ≥8 | ≥10 | ≥10 | IPC-TM-650 2.4.18 |
| HT (180 ° C | ≥6 | ≥6 | ≥6 | ≥6 | ≥6 | |||
| Ikaika ikaika (fr-4) | N / mm | ≥0.8 | ≥0.8 | ≥1.0 | ≥1.2 | ≥1.4 | IPC-TM-650 2.4.8 | |
| lbs / i | ≥4.6 | ≥4.6 | ≥5.7 | ≥6.8 | ≥8.0 | |||
| Polales & Pooshity | Nā helu | No | IPC-TM-650 2.1.2 | |||||
| Anti-'Oxidition | RT (23 ° C) | DNāʻAila | 180 | |||||
| HT (200 ° C) | MAKANAKAI | 30 | / | |||||
