Haʻahaʻa Coarsening Reverse lapaʻau Copper Foil

E like me ka foil keleawe i hoʻohuli ʻia, ʻoi aku ka maikaʻi o ka hana etchability o kēia huahana.Hiki iā ia ke hoʻopōkole pono i ke kaʻina hana, hoʻokō i ka wikiwiki kiʻekiʻe a me ka micro-etching wikiwiki, a hoʻomaikaʻi i ka helu conformance o PCB.

E hoʻouna i ka leka uila iā mākou

Huahana Huahana

kikoʻī

●Mānoanoa: 12um 18um 35um 70um
●Ka laulā maʻamau: 1290mm, hiki iā mākou ke hana i ka ʻokiʻoki e like me ke koi nui
●Puke pahu lāʻau
●ID: 76 mm, 152 mm
●Length: Hoʻopilikino
●Hiki ke hāʻawi ʻia ka laʻana
●Ke alakaʻi manawa: 15-30days
●Manaʻo: FOB, CIF...
●Uku 'ikamu: 50% T / T waiho, uku kaulike ma mua o ka hoʻouna.

Nā hiʻohiʻona

●Hoʻohuli ʻia ke keleawe keleawe i hoʻohuli ʻia
●ʻAno haʻahaʻa, me ka ikaika peel kiʻekiʻe
●ʻO ka pepa i mālama ʻia he ʻulaʻula
●E like me ka foil keleawe i hoʻohuli ʻia, ʻoi aku ka maikaʻi o ka hana etchability o kēia huahana.Hiki iā ia ke hoʻopōkole pono i ke kaʻina hana, hoʻokō i ka wikiwiki kiʻekiʻe a me ka micro-etching wikiwiki, a hoʻomaikaʻi i ka helu conformance o PCB.

Palapala noi

●Ke alapine kiʻekiʻe, Ultra-high frequency, e pili ana i ka papa PPE
●Kaapuni maikai
●Hoʻohana nui ʻia i nā papa multilayered a me nā papa kiʻekiʻe.

Nā ʻano maʻamau o ka ʻili keleawe i hoʻihoʻi ʻia

Hoʻokaʻawale			Unite	Koi				ʻAno hoʻāʻo
Mānoanoa inoa			um	12	18	35	70	IPC-4562A
Kaumaha ʻāpana			g/m²	107±5	153±7	285± 10	585± 20	IPC-TM-650 2.2.12
Maemae			%	≥99.8				IPC-TM-650 2.3.15
Roughness	ʻaoʻao ʻālohilohi (Ra)		um	3.0				IPC-TM-650 2.2.17
	ʻaoʻao maʻemaʻe(Rz)		um	≤5.0	≤6.0	≤8.0	≤10
Ikaika U'i	RT(23°C)		Mpa	≥276				IPC-TM-650 2.4.18
	H.T.(180°C)			≥138
ʻO ka lōʻihi	RT(23°C)		%	≥4	≥4	≥8	≥12	IPC-TM-650 2.4.18
	H.T.(180°C)			≥3	≥4	≥4	≥4
Ka Ihi (FR-4)			N/mm	≥1.0	≥1.2	≥1.4	≥1.8	IPC-TM-650 2.4.8
			Lbs/in	≥5.7	≥7.4	≥8.0	≥10.2
Pinholes & porosity			Helus	No				IPC-TM-650 2.1.2
Anati-oxidization		RT(23°C)	Nā lā	90
		H.T.(200°C)	Nā minuke	30