Ultra Low Profile Copper Foil No ka 5G High Frequency Papa
ʻO ka foil maka, nona ka ʻili ʻālohilohi me ka haʻahaʻa haʻahaʻa loa ma nā ʻaoʻao ʻelua, ua mālama ʻia me ka JIMA Copper proprietary micro-roughening process e hoʻokō ai i ka hana heleuma kiʻekiʻe a me ka haʻahaʻa haʻahaʻa loa.Hāʻawi ia i ka hana kiʻekiʻe ma kahi ākea o nā kahua, mai nā papa kaapuni paʻi paʻi ʻoi aku ka nui o ka waiwai o ka hoʻouna ʻana a me ka hana ʻana i ke ʻano maikaʻi i nā kaapuni paʻi maʻalahi e hoʻokaʻawale i ka ʻike.
●Hōʻike haʻahaʻa haʻahaʻa me ka ikaika peel kiʻekiʻe a me ka hiki ke etch maikaʻi.
●ʻO ka ʻenehana Hyper Low coarsening, ʻo ka microstructure kahi mea maikaʻi loa e hoʻopili ai i ke kaapuni hoʻouna alapine kiʻekiʻe.
●ʻO ka pepa i mālama ʻia he ʻulaʻula.
●Kaapuni lawe alapine kiʻekiʻe
●kahua kahua/kauwau
●Kikohoʻe wikiwiki kiʻekiʻe
●PPO/PPE
Hoʻokaʻawale | Unite | ʻAno hoʻāʻo | TʻO ke ʻano hana | |||
Mānoanoa inoa | Um | 12 | 18 | 35 | IPC-4562A | |
Kaumaha ʻāpana | g/m² | 107±5 | 153±7 | 285±10 | IPC-TM-650 2.2.12.2 | |
Maemae | % | ≥99.8 | IPC-TM-650 2.3.15 | |||
ʻoʻoleʻa | ʻaoʻao ʻālohilohi (Ra) | սm | ≤0.43 | ≤0.43 | ≤0.43 | IPC-TM-650 2.3.17 |
ʻaoʻao maʻemaʻe(Rz) | um | 1.5-2.0 | 1.5-2.0 | 1.5-2.0 |
| |
Ikaika U'i | RT(23°C) | Mpa | ≥300 | ≥300 | ≥300 | IPC-TM-650 2.4.18 |
HT(180°C) | ≥180 | ≥180 | ≥180 |
| ||
ʻO ka lōʻihi | RT(23°C) | % | ≥5 | ≥6 | ≥8 | IPC-TM-650 2.4.18 |
HT(180°C) | ≥6 | ≥6 | ≥6 |
| ||
Pinho & Porosity | Helu | No | IPC-TM-650 2.1.2 | |||
PKa ikaika iʻa | N/mm | ≥0.6 | ≥0.8 | ≥1.0 | IPC-TM-650 2.4.8 | |
Lbs/in | ≥3.4 | ≥4.6 | ≥5.7 | |||
Anati-oxidization | RT(23°C) | Nā lā | 90 |
| ||
RT(200°C) | Nā minuke | 40 |